The invention is to an array of stacked devices utilizing vertical surface mounted semiconductor devices stacked side by side and inserting the stack of devices into a casing. The packaged stack of devices creates a cube package which is capable of replacing SIMM boards, and saves considerable space....http://www.google.fr/patents/US5619067?utm_source=gb-gplus-shareBrevet US5619067 - Semiconductor device package side-by-side stacking and mounting system
Semiconductor device package side-by-side stacking and mounting system
