Disclosed is a heat sink clip assembly for releaseably attaching a heat sink to a DIP or similar electronic device package. The clip assembly includes a non-conductive attachment clip which extends between the leads on the underside of the DIP and means for latching the attachment clip to a heat sink...http://www.google.fr/patents/US4712159?utm_source=gb-gplus-shareBrevet US4712159 - Heat sink clip assembly
