Wire bonding inspection equipment includes a judging unit for judging whether or not wire bonding of a semiconductor device is acceptabe and for producing a defect signal when the semiconductor device is judged to be defective. In response to the defect signal wires of the defective semiconductor device...http://www.google.fr/patents/US5156319?utm_source=gb-gplus-shareBrevet US5156319 - Wire bonding inspection equipment
