Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being...http://www.google.fr/patents/US7691669?utm_source=gb-gplus-shareBrevet US7691669 - Techniques for providing decoupling capacitance
