A MEMS article is made by forming a MEMS device on a first substrate, providing a second substrate, depositing a layer of etchable dielectric material, forming at least one lateral post-bond release-etch port by a damascene process using a sacrificial material, and bonding the two substrates togethe...http://www.google.fr/patents/US7288464?utm_source=gb-gplus-shareBrevet US7288464 - MEMS packaging structure and methods
