A chip scale surface-mountable packaging method for electronic and micro-electro mechanical system (MEMS) devices is provided. The chip scale surface-mountable packaging method includes: (a) forming an interconnection and sealing pattern as a deep trench in one surface of a conductive cover substrate...http://www.google.fr/patents/US20020001873?utm_source=gb-gplus-shareBrevet US20020001873 - Chip scale surface-mountable packaging method for electronic and MEMS devices
Chip scale surface-mountable packaging method for electronic and MEMS devices
Numéro de demande: 09/886,286 Numéro de publication: US 2002/0001873 A1 Date de dépôt: 22 juin 2001 Brevet délivré: US6528344 ( Date de délivrance 4 mars 2003)
