Solutions for forming dielectric interconnect structures are provided. Specifically, the present invention provides methods of forming a dielectric interconnect structure having a noble metal layer that is formed directly on a modified dielectric surface. In a typical embodiment, the modified dielectric...http://www.google.fr/patents/US8105936?utm_source=gb-gplus-shareBrevet US8105936 - Methods for forming dielectric interconnect structures
Methods for forming dielectric interconnect structures
