There is provided a substrate processing method and apparatus which can measure and monitor the thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in the process conditions, and which can therefore stably provide a product of constant quality. A substrate...http://www.google.fr/patents/US20050009213?utm_source=gb-gplus-shareBrevet US20050009213 - Substrate processing method and apparatus
Numéro de demande: 10/874,245 Numéro de publication: US 2005/0009213 A1 Date de dépôt: 24 juin 2004 Brevet délivré: US7407821 ( Date de délivrance 5 août 2008)
