The present invention is directed to a method of controlling chemical mechanical polishing operations to control the duration of an endpoint polishing process. The method comprises providing a wafer having a layer of copper formed thereabove, performing a first timed polishing operation for a duration...http://www.google.fr/patents/US6746958?utm_source=gb-gplus-shareBrevet US6746958 - Method of controlling the duration of an endpoint polishing process in a multistage polishing process
Method of controlling the duration of an endpoint polishing process in a ...
