A low contact resistance and low junction leakage metal interconnect contact structure for use with ICs. The contact structure includes an interconnect dielectric material layer on the surface of an IC semiconductor substrate. The interconnect dielectric material layer has a contact opening which extends...http://www.google.fr/patents/US5998873?utm_source=gb-gplus-shareBrevet US5998873 - Low contact resistance and low junction leakage metal interconnect contact structure
Low contact resistance and low junction leakage metal interconnect contact ...
