An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured...http://www.google.fr/patents/US7698811?utm_source=gb-gplus-shareBrevet US7698811 - Method for manufacturing multilayer printed circuit boards using inner substrate
Method for manufacturing multilayer printed circuit boards using inner substrate
