The present invention relates to a bonding pad of a semiconductor device and a formation method thereof, and the object of the present invention is to prevent bonding defects by enlarging contact area between a bonding pad and a soldering material and to prevent moisture from penetrating into an oxide...http://www.google.fr/patents/US6995082?utm_source=gb-gplus-shareBrevet US6995082 - Bonding pad of a semiconductor device and formation method thereof
Bonding pad of a semiconductor device and formation method thereof
