An improved electrical connection between a metal surface and a semiconductor surface is provided by the deposition of a conductive dimple on the metal surface, whereby the conductive dimple is interposed between the metal surface and the semiconductor substrate. For example, a conductive trace deposited...http://www.google.fr/patents/US6078103?utm_source=gb-gplus-shareBrevet US6078103 - Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same
Dimpled contacts for metal-to-semiconductor connections, and methods for ...
