A method of forming a package structure includes providing a plurality of dies; attaching the plurality of dies onto a heat-dissipating plate; and sawing the heat-dissipating plate into a plurality of packages, each including one of the plurality of dies and a piece of the heat-dissipating plate....http://www.google.fr/patents/US8039315?utm_source=gb-gplus-shareBrevet US8039315 - Thermally enhanced wafer level package
