An integrated circuit (IC) package substrate has a dielectric layer and a micro filled via formed substantially in the center of a hole in the dielectric layer. The IC package substrate has at least one chip bonding pad and one ball attach pad that are electrically coupled to each other by the...http://www.google.fr/patents/US5767575?utm_source=gb-gplus-shareBrevet US5767575 - Ball grid array structure and method for packaging an integrated circuit chip
Ball grid array structure and method for packaging an integrated circuit ...
