Apparatus and methods for substantial planarization of solder bumps. In one embodiment, an apparatus includes a planarization member engageable with at least some of the plurality of outer surfaces to apply a planarization action on one or more of the outer surfaces to substantially planarize the plurality...http://www.google.fr/patents/US20010044262?utm_source=gb-gplus-shareBrevet US20010044262 - Apparatus and methods for substantial planarization of solder bumps
Apparatus and methods for substantial planarization of solder bumps
Numéro de demande: 09/919,268 Numéro de publication: US 2001/0044262 A1 Date de dépôt: 30 juil. 2001 Brevet délivré: US6543267 ( Date de délivrance 8 avr. 2003)
