Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric...http://www.google.fr/patents/US7921403?utm_source=gb-gplus-shareBrevet US7921403 - Controlling impedance and thickness variations for multilayer electronic structures
Controlling impedance and thickness variations for multilayer electronic ...
