A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position,...http://www.google.fr/patents/US6726823?utm_source=gb-gplus-shareBrevet US6726823 - Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
Methods and apparatus for holding and positioning semiconductor workpieces ...
