A circuit package for a microwave signal comprises a substrate defining a MMIC surface of the substrate and an opposing non-MMIC surface of the substrate. The substrate is devoid of signal carrying vias. A waveguide is disposed on the MMIC surface of the substrate. A MMIC is disposed on the MMIC surface...http://www.google.fr/patents/US6426686?utm_source=gb-gplus-shareBrevet US6426686 - Microwave circuit packages having a reduced number of vias in the substrate
Microwave circuit packages having a reduced number of vias in the substrate
