A polishing pad that can polish the surface of work pieces, such as semiconductor silicon wafers, with satisfactory results. Polishing pad 1.sub.1 is formed of a large number of resin polishing elements 11, all tubular with a very small diameter, inseparably bound together, outer peripheral surface to...http://www.google.fr/patents/US6089965?utm_source=gb-gplus-shareBrevet US6089965 - Polishing pad
