A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only...http://www.google.fr/patents/US4515671?utm_source=gb-gplus-shareBrevet US4515671 - Electrochemical treatment of copper for improving its bond strength
Electrochemical treatment of copper for improving its bond strength
