An article for providing a sealing engagement between an electronic component and an encapsulate material is provided, wherein the electronic component extends from the encapsulate material. The article includes a housing including at least one opening for receiving the electronic component. The housing...http://www.google.fr/patents/US7683261?utm_source=gb-gplus-shareBrevet US7683261 - Article and method for providing a seal for an encapsulated device
Article and method for providing a seal for an encapsulated device
