A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder...http://www.google.fr/patents/US6521981?utm_source=gb-gplus-shareBrevet US6521981 - Semiconductor device and manufacturing method thereof
Semiconductor device and manufacturing method thereof
