A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling...http://www.google.fr/patents/US20070273036?utm_source=gb-gplus-shareBrevet US20070273036 - Top layers of metal for high performance IC's
