A method for underfilling and encapsulating flip-chip configured semiconductor devices mounted on a carrier substrate using stereolithography (STL) to form, in situ, at least semisolid dam structures of photopolymeric material about the devices to entrap liquid, unpolymerized resin between the devices...http://www.google.fr/patents/US6881607?utm_source=gb-gplus-shareBrevet US6881607 - Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
Underfill and encapsulation of carrier substrate-mounted flip-chip ...
