An apparatus (10) for reducing the likelihood of damaging a semiconductor wafer (18) and the integrated circuit chips of the semiconductor wafer (18) during handling is disclosed. The apparatus (10) comprises a wafer interposer (12) having a wafer receiving portion (28) and a handling portion (30). The...http://www.google.fr/patents/US6686657?utm_source=gb-gplus-shareBrevet US6686657 - Interposer for improved handling of semiconductor wafers and method of use of same
Interposer for improved handling of semiconductor wafers and method of use ...
