Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The packaging system disclosed herein comprises a patterned spacer that, in...http://www.google.fr/patents/US7701631?utm_source=gb-gplus-shareBrevet US7701631 - Device having patterned spacers for backplates and method of making the same
Device having patterned spacers for backplates and method of making the same
