A semiconductor substrate processing system for polishing a substrate that generally includes a platen and a web of polishing material disposed thereon. Embodiments of the system include a disposable cartridge for housing the web of polishing material, a shield member disposed proximate the web for preventing...http://www.google.fr/patents/US6413873?utm_source=gb-gplus-shareBrevet US6413873 - System for chemical mechanical planarization
