The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate....http://www.google.fr/patents/US6982783?utm_source=gb-gplus-shareBrevet US6982783 - Chucking system for modulating shapes of substrates
Chucking system for modulating shapes of substrates
