Semiconductor devices and stacked die assemblies, and methods of fabrication are provided. In various embodiments, the die assembly comprises a first die mounted on a substrate and a second die mounted on the first die. In one embodiment, the second die has a recessed edge along the perimeter of the...http://www.google.fr/patents/US7344969?utm_source=gb-gplus-shareBrevet US7344969 - Stacked die in die BGA package
