A microelectronic die comprises a first area, a second area and an under-layer of conductive material formed in the second area to interconnect components. A method of making a microelectronic die comprises forming a layer of insulative material on a substrate; forming at least one trench in the layer...http://www.google.fr/patents/US6784026?utm_source=gb-gplus-shareBrevet US6784026 - Microelectronic die including low RC under-layer interconnects
Microelectronic die including low RC under-layer interconnects
