An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first...http://www.google.fr/patents/US20060033517?utm_source=gb-gplus-shareBrevet US20060033517 - Probe for semiconductor devices
Numéro de demande: 11/256,514 Numéro de publication: US 2006/0033517 A1 Date de dépôt: 19 oct. 2005 Brevet délivré: US7200930 ( Date de délivrance 10 avr. 2007)
