The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device...http://www.google.fr/patents/US6651866?utm_source=gb-gplus-shareBrevet US6651866 - Precision bond head for mounting semiconductor chips
Precision bond head for mounting semiconductor chips
