Computation-intensive applications such as sensor signal processing, sensor fusion, image processing, feature identification, pattern recognition, and early vision place stringent requirements on the computational capacity, size, weight, and power dissipation of modular computational systems intended...http://www.google.fr/patents/US5568574?utm_source=gb-gplus-shareBrevet US5568574 - Modulator-based photonic chip-to-chip interconnections for dense three-dimensional multichip module integration
Modulator-based photonic chip-to-chip interconnections for dense three ...
