In order to improve the operability of a burn-in apparatus, to shorten the operating time, to reduce the number of the components, and to increase the package density of semiconductor integrated circuits to be accommodated within a burn-in apparatus, semiconductor integrated circuits with a lead frame...http://www.google.fr/patents/US5247248?utm_source=gb-gplus-shareBrevet US5247248 - Burn-in apparatus and method of use thereof
