A method is described for mounting an electronic module in an opening in a card body using pressure and heat. To avoid the thermal load on the electronic module and the card body during the relatively short heating-up phase in a fixed-cycle production process, the method is divided into several method...http://www.google.fr/patents/US5951810?utm_source=gb-gplus-shareBrevet US5951810 - Method for mounting an electronic module in a card body
Method for mounting an electronic module in a card body
