A semiconductor device having a substrate with an insulating surface and a non-porous semiconductor region bonded to the body of the device. A porous semiconductor region on the surface of the substrate was removed by etching. ...http://www.google.fr/patents/US5750000?utm_source=gb-gplus-shareBrevet US5750000 - Semiconductor member, and process for preparing same and semiconductor device formed by use of same
Semiconductor member, and process for preparing same and semiconductor ...
