An integrated circuit package with lead fingers with a footprint on the order of the integrated circuit footprint is provided. A lead frame may be made from a metal sheet, which may be stamped or etched. The lead frame provides a plurality of posts and a connecting sheet connecting the plurality of posts....http://www.google.fr/patents/US6975038?utm_source=gb-gplus-shareBrevet US6975038 - Chip scale pin array
