A wafer level packaging method which produces a stacked dual/multiple die integrated circuit package. In the method, the wafer with the smaller sized dice of two wafers is processed through a metal redistribution process and then solder balls are attached. The wafer is then sawed into individual die...http://www.google.fr/patents/US6344401?utm_source=gb-gplus-shareBrevet US6344401 - Method of forming a stacked-die integrated circuit chip package on a water level
Method of forming a stacked-die integrated circuit chip package on a water level
