The present invention provides a method for forming a semiconductor region having a desired shape, and also provides a method for manufacturing a semiconductor device with few variations. Moreover, the present invention provides a method for manufacturing a semiconductor device which can reduce the cost...http://www.google.fr/patents/US20060046476?utm_source=gb-gplus-shareBrevet US20060046476 - Method for manufacturing semiconductor device
Numéro de demande: 11/206,787 Numéro de publication: US 2006/0046476 A1 Date de dépôt: 19 août 2005 Brevet délivré: US7622338 ( Date de délivrance 24 nov. 2009)
