A method and apparatus for endpointing a planarization process of a microelectronic substrate. The apparatus can include a source of electrical power having first and second electrical contacts coupled to the microelectronic substrate to form a conductive path through the substrate. An impedance of the...http://www.google.fr/patents/US6319420?utm_source=gb-gplus-shareBrevet US6319420 - Method and apparatus for electrically endpointing a chemical-mechanical planarization process
Method and apparatus for electrically endpointing a chemical-mechanical ...
