In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the...http://www.google.fr/patents/US5586389?utm_source=gb-gplus-shareBrevet US5586389 - Method for producing multi-board electronic device
Method for producing multi-board electronic device
