A semiconductor device comprises a plurality of bump electrodes at least to one surface. A circuit substrate is formed with a laminate structure having an inner layer circuit and a mounting pad is formed on the substrate. The mounting pad has a concave portion and the bottom of the concave portion is...http://www.google.fr/patents/US5874780?utm_source=gb-gplus-shareBrevet US5874780 - Method of mounting a semiconductor device to a substrate and a mounted structure
Method of mounting a semiconductor device to a substrate and a mounted structure
