An exposure method and apparatus for aligning a pattern of a mask with a pattern of a wafer is disclosed. and for transferring the pattern of the mask onto a resist layer formed on the surface of the wafer, wherein a portion of the resist layer on the wafer in the vicinity of an alignment mark formed...http://www.google.fr/patents/US5262822?utm_source=gb-gplus-shareBrevet US5262822 - Exposure method and apparatus
