A method of recycling a donor wafer after detaching at least one useful layer is provided, the donor wafer comprising successively a substrate, a buffer structure and, before detachment, a useful layer. The method comprises employing mechanical means to remove part of the donor wafer on the side where...http://www.google.fr/patents/US7033905?utm_source=gb-gplus-shareBrevet US7033905 - Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means
Recycling of a wafer comprising a buffer layer after having separated a thin ...
