A stackable microelectronic package includes a first microelectronic die attached to and electrically connecting with a first substrate. A second microelectronic die is attached to the first die on one side, and to a second substrate on the other side. Electrical connections are made between the first...http://www.google.fr/patents/US20070045803?utm_source=gb-gplus-shareBrevet US20070045803 - Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
Numéro de demande: 11/218,028 Numéro de publication: US 2007/0045803 A1 Date de dépôt: 31 août 2005 Brevet délivré: US7504284 ( Date de délivrance 17 mars 2009)
