The present invention provides a method for cleaning particles from a semiconductor topography that has been polished using a fixed-abrasive polishing process by applying a cleaning solution including either (a) an acid and a peroxide or (b) an acid oxidant to the topography. According to an embodiment,...http://www.google.fr/patents/US5972124?utm_source=gb-gplus-shareBrevet US5972124 - Method for cleaning a surface of a dielectric material
Method for cleaning a surface of a dielectric material
