An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further...http://www.google.fr/patents/US20050003606?utm_source=gb-gplus-shareBrevet US20050003606 - Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
Method and system for fabrication of integrated tunable/switchable passive ...
Numéro de demande: 10/897,271 Numéro de publication: US 2005/0003606 A1 Date de dépôt: 21 juil. 2004 Brevet délivré: US7368311 ( Date de délivrance 6 mai 2008)
