A split barrier layer enables copper interconnect wires to be used in conjunction with low-k dielectric films by preventing the diffusion of NH base groups into photoresists where they can render the photoresist insoluble. The split barrier layer is disposed between the copper and the low-k dielectric...http://www.google.fr/patents/US20030003765?utm_source=gb-gplus-shareBrevet US20030003765 - Split barrier layer including nitrogen-containing portion and oxygen-containing portion
Split barrier layer including nitrogen-containing portion and oxygen ...
Numéro de demande: 10/038,371 Numéro de publication: US 2003/0003765 A1 Date de dépôt: 2 janv. 2002 Brevet délivré: US6879046 ( Date de délivrance 12 avr. 2005)
