The method for hermetically encapsulating microsystems in situ consists, in a first phase, of mounting on a common substrate (1), several microsystems (6) surrounded by a metal adhesion layer (4) deposited on the substrate (1). In a second phase, in a common deposition step a first metal layer (7) is...http://www.google.fr/patents/US6454160?utm_source=gb-gplus-shareBrevet US6454160 - Method for hermetically encapsulating microsystems in situ
Method for hermetically encapsulating microsystems in situ
